Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade
La Rosa, A; Boscardin, M; Dalla Betta, G.-F.; Darbo, G; Gemme, C; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N; Bolle, Erlend; Borri, M; Da Via, C; Dong, S; Fazio, S; Grenier, P; Grinstein, S; Gjersdal, H; Hansson, P; Huegging, F; Jackson, P; Kocian, M; Riviero, F; Røhne, Ole Myren; Sandaker, Heidi; Sjøbak, K; Slavicek, T; Tsung, W; Tsybychev, D; Wermes, N; Young, C
Conference object, Journal article
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3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200μm, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110μm to 150μm. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 γ-ray sources, charge collection tests with Sr90 β-source and an overview of preliminary results from the CERN beam test.
Presented at: 9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors - RD09. Florence, Italy, 30 September - 2 October 2009