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dc.contributor.authorFiedler, Johannes
dc.contributor.authorPalau, Adria Salvador
dc.contributor.authorOsestad, Eivind Kristen
dc.contributor.authorParviainen, Pekka
dc.contributor.authorHolst, Bodil
dc.date.accessioned2024-05-02T10:54:58Z
dc.date.available2024-05-02T10:54:58Z
dc.date.created2023-07-04T13:34:46Z
dc.date.issued2023
dc.identifier.issn2632-2153
dc.identifier.urihttps://hdl.handle.net/11250/3128782
dc.description.abstractFast production of large-area patterns is crucial for the established semiconductor industry and enables industrial-scale production of next-generation quantum devices. Metastable atom lithography with binary holography masks has been suggested as a higher resolution/low-cost alternative to the current state of the art: extreme ultraviolet lithography. However, it was recently shown that the interaction of the metastable atoms with the mask material (SiN) leads to a strong perturbation of the wavefront, not included in the existing mask generation theory, which is based on classical scalar waves. This means that the inverse problem (creating a mask based on the desired pattern) cannot be solved analytically, even in 1D. Here we present a machine-learning approach to mask generation targeted for metastable atoms. Our algorithm uses a combination of genetic optimisation and deep learning to obtain the mask. A novel deep neural architecture is trained to produce an initial approximation of the mask. This approximation is then used to generate the initial population of the genetic optimisation algorithm that can converge to arbitrary precision. We demonstrate the generation of arbitrary 1D patterns for system dimensions within the Fraunhofer approximation limit.en_US
dc.language.isoengen_US
dc.publisherIOPen_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleRealistic mask generation for matter-wave lithography via machine learningen_US
dc.typeJournal articleen_US
dc.typePeer revieweden_US
dc.description.versionpublishedVersionen_US
dc.rights.holderCopyright 2023 The Author(s)en_US
dc.source.articlenumber025028en_US
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1
dc.identifier.doi10.1088/2632-2153/acd988
dc.identifier.cristin2160685
dc.source.journalMachine Learning: Science and Technologyen_US
dc.identifier.citationMachine Learning: Science and Technology. 2023, 4 (2), 025028.en_US
dc.source.volume4en_US
dc.source.issue2en_US


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Navngivelse 4.0 Internasjonal
Except where otherwise noted, this item's license is described as Navngivelse 4.0 Internasjonal