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dc.contributor.authorHelseth, Lars Egil
dc.contributor.authorGreve, Martin Møller
dc.date.accessioned2023-04-04T07:58:53Z
dc.date.available2023-04-04T07:58:53Z
dc.date.created2023-03-01T12:29:48Z
dc.date.issued2023
dc.identifier.issn0021-9606
dc.identifier.urihttps://hdl.handle.net/11250/3061969
dc.description.abstractPorous solid films that promote large apparent contact angles are interesting systems since their wetting properties are dependent on both the surface structure and water penetration into the film. In this study, a parahydrophobic coating is made by sequential dip coating of titanium dioxide nanoparticles and stearic acid on polished copper substrates. The apparent contact angles are determined using the tilted plate method, and it is found that the liquid–vapor interaction decreases and water droplets are more likely to move off the film when the number of coated layers increases. Interestingly, it is found that under some conditions, the front contact angle can be smaller than the back contact angle. Scanning electron microscopy observations demonstrate that the coating process led to the formation of hydrophilic TiO2 nanoparticle domains and hydrophobic stearic acid flakes that allows heterogeneous wetting. By monitoring the electrical current through the water droplet to the copper substrate, it is found that the water drops penetrate the coating layer to make direct contact with the copper surface with a time delay and magnitude that depends on the coating thickness. This additional penetration of water into the porous film enhances the adhesion of the droplet to the film and provides a clue to understand the contact angle hysteresis.en_US
dc.language.isoengen_US
dc.publisherAIPen_US
dc.titleWetting of porous thin films exhibiting large contact anglesen_US
dc.typeJournal articleen_US
dc.typePeer revieweden_US
dc.description.versionacceptedVersionen_US
dc.rights.holderCopyright 2023 The Author(s)en_US
dc.source.articlenumber094701en_US
cristin.ispublishedtrue
cristin.fulltextpostprint
cristin.qualitycode1
dc.identifier.doihttps://doi.org/10.1063/5.0138148
dc.identifier.cristin2130447
dc.source.journalJournal of Chemical Physicsen_US
dc.identifier.citationJournal of Chemical Physics. 2023, 158, 094701.en_US
dc.source.volume158en_US


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